FEATURES:

Alseye T9+ Platinum,

for your high-end gaming devices !!!

• Non-curing materials
• High thermal conductivity
• Able to achieve very thin bond line thickness
• Low thermal resistance
• Thixotropic, low slump
• Low volatile

 90% of the CPU temperature increase is due to the loss of thermal paste performance, not because of the heatsink dust or cooling fan performance degradation.

Outstanding Thermal Management

T9+ Platinum is formulated with thermally conductive filler particles and optimized silicone polymers to inprove the performance and reliability. 

T9+ Platinum Thermal Conductivity

Conductive filler particles and optimized silicone polymers create an uninterrupted, thermally-conductive path between CPU & heatsink.

Long-term Material Stability

T9+ Platinum stays strong over the full operating cycle of your gaming hardware, exhibiting minimal evaporation over a wide operating temperature range----even in a vacuum atmosphere (10-5 tor/mil, 24hrs@100℃).

Alseye T9+ Platinum

For top builds and high-end setups

Offering high thermal conductivity of 13.5 W/mK and the ability to achieve a very thin bond line thickness of approximately 18 um,

Thermally Conductive Compound yields low thermal resistance of 0.038℃-cm²/ W

Technical Specifications: